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• W2073191912 abstract "The main objective of this paper is to investigate a way to characterize experimentally the mechanical behavior of low modulus adhesives. In this context, the relaxation and complex moluli master curves of a SIKAFLEX® 505 adhesive are obtained by means of dynamic mechanical thermal analysis. Firstly, the procedure carried out to prepare and to validate the test specimens is explained. Next, the influence of the test specimen thickness and strain level is studied. Finally, the relaxation and dynamic master curve sunder tension strain are constructed via a procedure based on the time-temperature superposition principle." @default.
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• W2073191912 date "2012-04-01" @default.
• W2073191912 modified "2023-10-01" @default.
• W2073191912 title "A Low Modulus Adhesive Characterization by Means of DMTA Testing" @default.
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• W2073191912 doi "https://doi.org/10.1080/00218464.2012.660815" @default.
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