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- W2073242883 abstract "Poly-Si TFTs with vacuum cavity next to the gate-oxide edge (quasi T-gate TFTs) have been fabricated with the wet-etching of gate-oxide and in-situ vacuum encapsulation techniques. The device characteristics of the quasi T-gate TFTs are examined and better than those of conventional TFTs, resulting from the vacuum cavity as the offset region to reduce the leakage current and as the field-induced drain (FID) to maintain the on-current. Furthermore, owing to the simultaneous reduction of the vertical and lateral electric field near the drain as bias stressing, the quasi T-gate TFTs achieve superior reliability than conventional ones." @default.
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- W2073242883 date "2010-07-01" @default.
- W2073242883 modified "2023-09-26" @default.
- W2073242883 title "P1–2: A novel poly-Si TFTs with vacuum cavity next to the gate-oxide edge" @default.
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- W2073242883 doi "https://doi.org/10.1109/ivnc.2010.5563179" @default.
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