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- W2073603074 abstract "This study investigated the electrical resistivities and thermal stabilities of Cu/(Fe0.55Co0.45)90B6Ti2Nb2/Si structure and Cu((Fe0.55Co0.45)90B6Ti2Nb2)/Si alloy films. The films were prepared by magnetron sputtering using a (Fe0.55Co0.45)90B6Ti2Nb2 target and a Cu target. The as-deposited (Fe0.55Co0.45)90B6Ti2Nb2 film is amorphous, and the film remains its noncrystallinity up to a temperature of 500 °C. Diffusion barrier characteristics showed that the sandwiched Cu/(Fe0.55Co0.45)90B6Ti2Nb2/Si film, in which the (Fe0.55Co0.45)90B6Ti2Nb2 film was deposited under a substrate bias of −200 V, had a failure temperature of 575 °C. Barrierless Cu0.793((Fe0.55Co0.45)90B6Ti2Nb2)0.207/Si alloy film had the lowest resistivity of 2.7 μΩ cm when the film was annealed at 600 °C, and Cu0.699((Fe0.55Co0.45)90B6Ti2Nb2)0.301/Si alloy film had the highest failure temperature of at least 750 °C. The low resistive Cu((Fe0.55Co0.45)90B6Ti2Nb2) alloy film is promising to be used as a barrierless Cu interconnects." @default.
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- W2073603074 date "2014-02-01" @default.
- W2073603074 modified "2023-09-25" @default.
- W2073603074 title "Low resistivity Fe–Co–B–Ti–Nb amorphous thin film as a copper barrier" @default.
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- W2073603074 doi "https://doi.org/10.1016/j.jallcom.2012.10.190" @default.
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