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• W2073865472 abstract "In this study the performance of organic PCMs used as latent heat storage materials, when incorporated in coatings for buildings and urban fabric, is investigated. Thirty six coatings of six colors containing different quantities of PCMs in different melting points were produced. Accordingly, infrared reflective (cool) and common coatings with the same binder system and of the same color were prepared for a comparative thermal evaluation. The samples were divided in six groups of different color and eight samples each: three PCM coatings of different melting temperatures (18 °C, 24 °C, 28 °C) each one of two different PCM concentrations (20% w/w, 30% w/w), an infrared reflective and a common coating of matching color. Surface temperature of the samples was recorded at a 24 h basis during August 2008. The results demonstrate that all PCM coatings present lower surface temperatures than infrared reflective and common coatings. Analysis of the daily temperature differences showed that peak temperature differences occur between PCM and common or cool coatings from 7 am to 10 am. Investigating the temperature gradient revealed that for this time period the values for PCM coatings are lower compared to infrared reflective and common. From 10 am to 12 pm, temperature gradients for all coatings have similar values. Thus coatings containing PCMs store heat in a latent form maintaining constant surface temperatures and discharge with time delay. PCM doped cool colored coatings have the potential to enhance thermal inertia and achieve important energy savings in buildings maintaining a thermally comfortable indoor environment, while fighting urban heat island when applied on external surfaces." @default.
• W2073865472 created "2016-06-24" @default.
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• W2073865472 date "2011-03-01" @default.
• W2073865472 modified "2023-09-28" @default.
• W2073865472 title "Development and testing of PCM doped cool colored coatings to mitigate urban heat island and cool buildings" @default.
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• W2073865472 doi "https://doi.org/10.1016/j.buildenv.2010.09.003" @default.
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