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- W2074242521 abstract "The glass transition temperature (Tg) is related to the two main concerns encountered with chemically amplified resists, namely delay-time and contamination effects. However, Tg is often convoluted with the deprotection reaction and cannot be determined using conventional thermal analysis techniques (e.g., DSC). This problem can nevertheless be circumvented using the wafer curvature measurement technique (WCM). Thus, DSC and WCM appear to be complementary techniques for the complete thermal characterization of DUV resists. Each technique provides one of the two temperature boundaries of an optimum process window. Various DUV positive resists, representative of different cases, are investigated.© (1995) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only." @default.
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- W2074242521 date "1995-06-09" @default.
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- W2074242521 title "<title>Use of wafer curvature measurement (WCM) techniques in the determination of the process window of positive DUV resists</title>" @default.
- W2074242521 doi "https://doi.org/10.1117/12.210366" @default.
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