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- W2074477995 abstract "Abstract An approach for fabrication of planar devices integrating layered Bi 2 Te 3 thin-films with different microscale thicknesses instead of bulk materials is reported. The films were prepared by the radio-frequency magnetron sputtering. The microstructure, composition, and thermoelectric (TE) properties of the thin-films were characterized using X-ray diffraction, scanning electron microscopy with energy dispersive X-ray spectroscopy, and a TE measurement system, respectively. The results show that the Bi 2 Te 3 films with layered microstructure possess promising TE properties. The power generation and cooling performance of parallel micro-devices with n -type thermolegs were tested and found to be superior to those of bulk material devices. For a typical parallel device with 38 optimized 2-μm-thick legs, the output voltage, estimated maximum power and corresponding power density are up to 5.6 mV, 6.53 μW and 43 mW cm − 2 , respectively, for a temperature difference of 81 K. The coefficient of performance (COP max ) of the device was also estimated. The minimum value of COP max approaches 6.8 at Δ T = 3.2 K. The results prove that high performance of micro-device with low internal resistance can be realized by integrating special layered Bi 2 Te 3 thin-films." @default.
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- W2074477995 date "2013-12-01" @default.
- W2074477995 modified "2023-10-16" @default.
- W2074477995 title "Improved performance of thermoelectric micro-device by integrating a layered Bi2Te3 film" @default.
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- W2074477995 doi "https://doi.org/10.1016/j.tsf.2013.08.091" @default.
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