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• W2074849781 startingPage "66" @default.
• W2074849781 abstract "Electromigration is a major road block in the pursuit of nanoelectronics and next generation power electronics. The current density in the state-of-the-art microelectronics solder joints is about 103 A/cm2. In the next generation nanoelectronics solder joints this current density is expected to increase by an order of magnitude, at least. In this paper, a new damage mechanics formulation is implemented in a general finite element procedure and used for simulation of solder joints electromigration induced failure. Nonlinear viscoplastic time-dependent nature of the material and current crowding effects are taken into account in the formulation. The model is verified against test data." @default.
• W2074849781 created "2016-06-24" @default.
• W2074849781 creator A5047534866 @default.
• W2074849781 creator A5079646688 @default.
• W2074849781 date "2008-01-01" @default.
• W2074849781 modified "2023-09-30" @default.
• W2074849781 title "Damage mechanics of electromigration induced failure" @default.
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• W2074849781 doi "https://doi.org/10.1016/j.mechmat.2007.06.006" @default.
• W2074849781 hasPublicationYear "2008" @default.
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