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- W2075760100 abstract "Highly robust metallizations in ICs for high temperature and high current applications are needed. Special thick metal layers often known as “power metals” are added to achieve a higher current capability. But these metallizations suffer from reliability limitations as well. Therefore a new design for “power metals” was created for a 0.35μm aluminium CMOS process. The reliability of a new power metal structure is investigated in this article. A determination of the thermal-electrical and thermo-mechanical behaviour is carried out by simulations." @default.
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- W2075760100 date "2013-04-01" @default.
- W2075760100 modified "2023-09-26" @default.
- W2075760100 title "Characterization of a new designed octahedron slotted metal track by simulations" @default.
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- W2075760100 doi "https://doi.org/10.1109/eurosime.2013.6529907" @default.
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