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• W2076486214 endingPage "14" @default.
• W2076486214 startingPage "7" @default.
• W2076486214 abstract "As the demand for flip‐chip products increases, the need for low cost high volume manufacturing processes also increases. Currently solder paste printing is the wafer bumping method of choice for device pitches down to 150‐200μm. However, limitations in print quality and stencil manufacture mean that this technology is not likely to move significantly below this pitch and new methods will be required to meet the demands predicted by the technology roadmaps. This paper describes experiments conducted on carriers made from silicon for bumping of die using solder paste. An anisotropic etching process was used to generate pockets in the silicon surface into which solder paste was printed. Die were then placed against the carrier and reflowed to transfer the solder directly to the bondpads. An assessment was carried out of the potential application and limitations of this technique for device pitches at 225 and 127μm." @default.
• W2076486214 created "2016-06-24" @default.
• W2076486214 creator A5000992079 @default.
• W2076486214 creator A5003421237 @default.
• W2076486214 creator A5007640209 @default.
• W2076486214 creator A5016297677 @default.
• W2076486214 creator A5049350510 @default.
• W2076486214 creator A5049403171 @default.
• W2076486214 date "2000-04-01" @default.
• W2076486214 modified "2023-09-27" @default.
• W2076486214 title "Investigation of a solder bumping technique for flip‐chip interconnection" @default.
• W2076486214 cites W2032273777 @default.
• W2076486214 cites W2113249900 @default.
• W2076486214 cites W2127725201 @default.
• W2076486214 cites W2148265096 @default.
• W2076486214 cites W4251686737 @default.
• W2076486214 cites W44695404 @default.
• W2076486214 doi "https://doi.org/10.1108/09540910010312366" @default.
• W2076486214 hasPublicationYear "2000" @default.
• W2076486214 type Work @default.
• W2076486214 sameAs 2076486214 @default.
• W2076486214 citedByCount "1" @default.
• W2076486214 crossrefType "journal-article" @default.
• W2076486214 hasAuthorship W2076486214A5000992079 @default.
• W2076486214 hasAuthorship W2076486214A5003421237 @default.
• W2076486214 hasAuthorship W2076486214A5007640209 @default.
• W2076486214 hasAuthorship W2076486214A5016297677 @default.
• W2076486214 hasAuthorship W2076486214A5049350510 @default.
• W2076486214 hasAuthorship W2076486214A5049403171 @default.
• W2076486214 hasBestOaLocation W20764862142 @default.
• W2076486214 hasConcept C100460472 @default.
• W2076486214 hasConcept C111106434 @default.
• W2076486214 hasConcept C119599485 @default.
• W2076486214 hasConcept C123745756 @default.
• W2076486214 hasConcept C126233035 @default.
• W2076486214 hasConcept C127413603 @default.
• W2076486214 hasConcept C159985019 @default.
• W2076486214 hasConcept C160671074 @default.
• W2076486214 hasConcept C165005293 @default.
• W2076486214 hasConcept C171250308 @default.
• W2076486214 hasConcept C186260285 @default.
• W2076486214 hasConcept C191281628 @default.
• W2076486214 hasConcept C191897082 @default.
• W2076486214 hasConcept C192562407 @default.
• W2076486214 hasConcept C199639397 @default.
• W2076486214 hasConcept C2776512755 @default.
• W2076486214 hasConcept C2778413121 @default.
• W2076486214 hasConcept C2779227376 @default.
• W2076486214 hasConcept C31258907 @default.
• W2076486214 hasConcept C41008148 @default.
• W2076486214 hasConcept C49040817 @default.
• W2076486214 hasConcept C50296614 @default.
• W2076486214 hasConcept C530198007 @default.
• W2076486214 hasConcept C68928338 @default.
• W2076486214 hasConcept C78519656 @default.
• W2076486214 hasConcept C79072407 @default.
• W2076486214 hasConcept C94709252 @default.
• W2076486214 hasConceptScore W2076486214C100460472 @default.
• W2076486214 hasConceptScore W2076486214C111106434 @default.
• W2076486214 hasConceptScore W2076486214C119599485 @default.
• W2076486214 hasConceptScore W2076486214C123745756 @default.
• W2076486214 hasConceptScore W2076486214C126233035 @default.
• W2076486214 hasConceptScore W2076486214C127413603 @default.
• W2076486214 hasConceptScore W2076486214C159985019 @default.
• W2076486214 hasConceptScore W2076486214C160671074 @default.
• W2076486214 hasConceptScore W2076486214C165005293 @default.
• W2076486214 hasConceptScore W2076486214C171250308 @default.
• W2076486214 hasConceptScore W2076486214C186260285 @default.
• W2076486214 hasConceptScore W2076486214C191281628 @default.
• W2076486214 hasConceptScore W2076486214C191897082 @default.
• W2076486214 hasConceptScore W2076486214C192562407 @default.
• W2076486214 hasConceptScore W2076486214C199639397 @default.
• W2076486214 hasConceptScore W2076486214C2776512755 @default.
• W2076486214 hasConceptScore W2076486214C2778413121 @default.
• W2076486214 hasConceptScore W2076486214C2779227376 @default.
• W2076486214 hasConceptScore W2076486214C31258907 @default.
• W2076486214 hasConceptScore W2076486214C41008148 @default.
• W2076486214 hasConceptScore W2076486214C49040817 @default.
• W2076486214 hasConceptScore W2076486214C50296614 @default.
• W2076486214 hasConceptScore W2076486214C530198007 @default.
• W2076486214 hasConceptScore W2076486214C68928338 @default.
• W2076486214 hasConceptScore W2076486214C78519656 @default.
• W2076486214 hasConceptScore W2076486214C79072407 @default.
• W2076486214 hasConceptScore W2076486214C94709252 @default.
• W2076486214 hasIssue "1" @default.
• W2076486214 hasLocation W20764862141 @default.
• W2076486214 hasLocation W20764862142 @default.
• W2076486214 hasLocation W20764862143 @default.
• W2076486214 hasOpenAccess W2076486214 @default.
• W2076486214 hasPrimaryLocation W20764862141 @default.
• W2076486214 hasRelatedWork W1892576378 @default.
• W2076486214 hasRelatedWork W2038527913 @default.
• W2076486214 hasRelatedWork W2076486214 @default.
• W2076486214 hasRelatedWork W2089705486 @default.
• W2076486214 hasRelatedWork W2109256198 @default.
• W2076486214 hasRelatedWork W2110643457 @default.
• W2076486214 hasRelatedWork W2125111247 @default.
• W2076486214 hasRelatedWork W2165726551 @default.

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