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- W2076952944 abstract "Beryllium has been proposed to be used as a plasma facing material of the first wall for ITER, and will be bonded by HIP process to Dispersion Strengthened Copper (DSCu). Be/DSCu diffusion bonding tests in the range of temperature from 600°C to 850°C by hot pressing techniques have been conducted to identify the effect of bonding temperature and time on interface formation and joint strength. The bonded Be/DSCu joints were evaluated by microstructural analysis of the interface and shear strength tests at room temperature. The diffusion layer of directly bonded Be/DSCu joints and the joints with Be–Cu interlayer consisted of Be2Cu(δ) phase on the Be side and Cu + BeCu(γ) phase on the DSCu side. Cu + BeCu(γ) phase generated remarkably fast at 800–850°C. The thickness of the diffusion layer was linear to a square root of bonding time. Shear strength of the joints bonded at 650–750°C are all around 200 MPa. Shear strength is dominated by the formation of the layer of Be2Cu(δ) phase on the Be side." @default.
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- W2076952944 date "1998-10-01" @default.
- W2076952944 modified "2023-09-23" @default.
- W2076952944 title "Interface formation and strength of Be/DSCu diffusion bonding" @default.
- W2076952944 doi "https://doi.org/10.1016/s0022-3115(98)00364-x" @default.
- W2076952944 hasPublicationYear "1998" @default.
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