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- W2077119791 abstract "Purpose – Tracks, pads and vias on printed circuit boards can suffer from a variety of problems, if the surfaces are contaminated with electrically‐conducting substances. Aims to model a multilevel full‐factorial design to study the effects of temperature, voltage and electrode gap on dendritic growth under saturated conditions, i.e. water droplet contamination.Design/methodology/approach – Preparation of several DC‐biased combed‐copper interdigitated capacitors placed in temperature‐controlled water‐filled cuvettes enabled the specific monitoring of dendrite activity. The monitoring used the detection of sharp current increase that accompany a dendritic short circuit condition.Findings – A high R2 polynomial model was produced and it was noted that increased voltages reduce the reliability impact of dendritic growth.Originality/value – The paper focuses on the reliability impact dendritic growth in saturated conditions." @default.
- W2077119791 created "2016-06-24" @default.
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- W2077119791 date "2007-04-24" @default.
- W2077119791 modified "2023-09-26" @default.
- W2077119791 title "Modeling and analysis of the growth of copper dendrites in saturated conditions using a multilevel factorial design analysis" @default.
- W2077119791 cites W2169158625 @default.
- W2077119791 doi "https://doi.org/10.1108/13565360710745575" @default.
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