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- W2077352125 abstract "Etchant residue and backscattered material have been observed on silicon surfaces etched in a CF4 plasma. In addition to chemical contamination, the surface is damaged by ion bombardment with dissociated CF4 ions. X-ray photoelectron spectroscopy and reflection high-energy electron diffraction were used to study the extent of the damage and how it correlates with surface contamination. At low ion energies, a well ordered crystal surface is observed in the presence of fluorine contamination. At higher ion energies (>400 V), the silicon surface is contaminated by backscattered nickel from an unshielded contact lead and the silicon surface becomes polycrystalline." @default.
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- W2077352125 date "1985-10-01" @default.
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- W2077352125 title "Analysis of ion induced surface damage on silicon etched in a CF4 plasma" @default.
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- W2077352125 doi "https://doi.org/10.1063/1.96025" @default.
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