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- W2077570327 abstract "This paper presents a comparison of the resistance performance of Au-Au micro-contacts fabricated with planar and engineered lower contacts. Gray-scale lithography was used to construct 3D structures into photoresist. The structures were then etched into a silicon wafer using a Trion reactive ion etch (RIE) system. The engineered lower contact surfaces consisted of 2D pyramids and 3D pyramid patterns paired with a hemispherical upper contact. A microelectromechanical systems (MEMS) micro-contact support structure, consisting of a fixed-fixed beam, was micro machined as the upper contact. The micro-contact support structure was used as the platform for a hemisphere shaped upper contact. The micro-contacts were actuated using an external, calibrated load. To observe micro-contact performance, the contact resistance and force required to close the contact, were monitored throughout testing. Next the micro-contacts underwent contact resistance testing to evaluate how the engineered lower contacts affected performance. Results show that the 3D pyramid design closely matched the hemisphere/planar contact data with a contact resistance of 0.7Ω after 10 <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>7</sup> cycles. The 2D pyramid pattern resulted in a higher contact resistance during initial testing and then ended with a contact resistance of 1.083Ω after 10 <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>7</sup> cycles." @default.
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- W2077570327 date "2014-10-01" @default.
- W2077570327 modified "2023-09-26" @default.
- W2077570327 title "Contact resistance evaluation of micro-contacts with upper hemisphere and lower planar or engineered surfaces" @default.
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- W2077570327 doi "https://doi.org/10.1109/holm.2014.7031033" @default.
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