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- W2077950341 abstract "Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) package are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed Cor several bending loads and temperatures. At the temperature higher than 100℃, the inelastic deformation in solder balls become more dominant, so that the bending of the molding compound decreases while temperature increases. The deformation caused by thermally induced bending is compared with that caused by mechanical bending. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder." @default.
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- W2077950341 date "2002-07-01" @default.
- W2077950341 modified "2023-10-18" @default.
- W2077950341 title "Thermo-mechanical and Flexural Analysis of WB-PBGA Package Using Moire Interferometry" @default.
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- W2077950341 doi "https://doi.org/10.3795/ksme-a.2002.26.7.1302" @default.
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