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- W2078110313 endingPage "05EC01" @default.
- W2078110313 startingPage "05EC01" @default.
- W2078110313 abstract "Wire bonding technology is used in most semiconductor products. Recently, high gold prices have forced semiconductor manufacturers to replace Au wires with Cu wires. Because Cu wire bonds are vulnerable to high temperature and humidity, they remain unpopular in automotive and industrial applications with narrow-bond-pad pitches and small deformed ball diameters. To avoid forming the corrosive Cu-rich intermetallic compound Cu9Al4, the use of a Ni/Pd(/Au) over-pad metallization (OPM) structure produced by electroless plating on the Al metallization has been proposed. However, certain technical issues must be overcome, such as variations in the purity and thickness of the plating. To tackle these issues, a novel OPM structure produced by physical vapor deposition is proposed and evaluated in this study." @default.
- W2078110313 created "2016-06-24" @default.
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- W2078110313 date "2015-04-07" @default.
- W2078110313 modified "2023-09-27" @default.
- W2078110313 title "Reliability of copper wire bonds on a novel over-pad metallization" @default.
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- W2078110313 doi "https://doi.org/10.7567/jjap.54.05ec01" @default.
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