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- W2078404080 abstract "The effectiveness of residual stress on forming copper patterns of printed circuit board was investigated during applied thermal conditions. Generally, the electrolytic copper foil showed a compressive residual stress about -55~-60MPa as received, which easily caused to form copper patterns irregularly when the pattern was etched finely. The compressive residual stress was relaxed with applying heat-treatment for a few hours. However, we observed that the compressed residual stress of copper foil tended to be relaxed, constant, and compressed again during heat-treatment process, which is mainly considered as that the grain of copper is grown restrictively within a Cu thin foil layer. We suggested a quantitative method for controlling grain size, grain distribution and relaxing stress of copper foil, which was very helpful for increasing an etching factor to decrease pattern width." @default.
- W2078404080 created "2016-06-24" @default.
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- W2078404080 date "2010-08-01" @default.
- W2078404080 modified "2023-09-25" @default.
- W2078404080 title "Improvement in Etching Factor of Micro Patterns by Controlling Residual Stress of Copper Thin Foil" @default.
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- W2078404080 doi "https://doi.org/10.4028/www.scientific.net/amr.123-125.479" @default.
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