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• W2078404667 abstract "For the polymer-supported metal thin films that are finding increasing applications, the critical strain to nucleate microcracks (εC) should be more meaningful than generally measured rupture strain. In this letter, the εC values of polymer-supported Cu films are simply but precisely determined by measurements of both electrical resistance and statistical microcrack density changes on the film surface. Significant thickness dependence of εC, i.e., the thinner the film the lower the εC, has been revealed for the Cu films with a thickness range from 700 down to 60nm, which is suggested to result from the constraint effect of refining grain size on the dislocation movability." @default.
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• W2078404667 date "2007-04-16" @default.
• W2078404667 modified "2023-09-26" @default.
• W2078404667 title "Thickness dependent critical strain in submicron Cu films adherent to polymer substrate" @default.
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• W2078404667 doi "https://doi.org/10.1063/1.2722684" @default.
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