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- W2078429424 abstract "Improved via connections in structures of YBa/sub 2/Cu/sub 3/O/sub 7-x//SrTiO/sub 3//YBa/sub 2/Cu/sub 3/O/sub 7-x/ (YBCO/STO/YBCO) multilayers have been made using a combined HF wet-etching and ion-milling process. The critical current density J/sub c/ of the via is as high as 2/spl times/10/sup 6/ A/cm/sup 2/ at 76 K, and is dominated by edge contacts in the ab-plane, YBCO and Sr/sub 2/AlNbO/sub 6/ (SAN) multilayer test circuits were also made with this process. The 4/spl deg/ crossovers in a SAN test chip had a critical temperature T/sub c/ of 88 K and J/sub c/ of 1.5/spl times/10/sup 6/ A/cm/sup 2/ at 81 K, very close to those of the planar film, showing no evidence of weak links in the YBCO crossing low angle SAN steps." @default.
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- W2078429424 date "1997-06-01" @default.
- W2078429424 modified "2023-09-25" @default.
- W2078429424 title "An improved multi-layer fabrication process for YBa/sub 2/Cu/sub 3/O/sub 7-x/-based circuits" @default.
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- W2078429424 doi "https://doi.org/10.1109/77.621023" @default.
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