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• W2078760900 abstract "We demonstrate a superpolishing electrolyte, which consists of acid additives in conventional Cu polishing electrolytes for efficiently planarizing Cu damascene features. The significant additive concentration gradient in features, resulting in a selective Cu dissolution rate within features, is explored as a major mechanism that yields such electrolytes with high planarization efficiency. Moreover, another additive, polyethylene glycol as a suppressor, is also employed to reduce oxygen bubbling on polished films. Consequently, a smooth surface with a complete step height elimination is obtained in a 70 μm trench after electropolishing. © 2003 The Electrochemical Society. All rights reserved." @default.
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• W2078760900 date "2003-01-01" @default.
• W2078760900 modified "2023-10-18" @default.
• W2078760900 title "Superpolishing for Planarizing Copper Damascene Interconnects" @default.
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• W2078760900 doi "https://doi.org/10.1149/1.1565853" @default.
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