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• W2078951258 abstract "We demonstrated a novel and simple approach to obtain a reliable Cu/SiO2 stack. The key is the combination of SiO2 surface doping with Zn and intermixing acceleration by a noble metal catalyst. Zn was incorporated into the SiO2 surface by heat treatment of ZnO/SiO2 stacks. The intermixing layer was formed even when Cu films were deposited at room temperature, and this layer dramatically improved the adhesion between Cu and SiO2." @default.
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• W2078951258 date "2014-04-15" @default.
• W2078951258 modified "2023-10-14" @default.
• W2078951258 title "Room-temperature intermixing for adhesion enhancement of Cu/SiO₂interface by adopting SiO₂surface dope and noble metal catalyzation" @default.
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• W2078951258 doi "https://doi.org/10.7567/jjap.53.05ga02" @default.
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