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- W2078972003 abstract "One of the challenges of laser cooling a semiconductor is the typically high index of refraction (greater than 3), which limits efficient light output of the upconverted photon. This challenge is proposed to be met with a novel concept of coupling the photon out via a thin, thermally insulating vacuum gap that allows light to pass efficiently by frustrated total internal reflection. This study has the goal of producing a test structure that allows investigation of heat transport across a 'nanogap' consisting of a thin film supported over a substrate by an array of nanometer-sized posts. The nanogap is fabricated monolithically by first creating a film of SiO<sub>2</sub> on a silicon substrate, lithographically defining holes in the SiO<sub>2</sub>, and covering this structure including the holes with silicon. Selective lateral etching will then remove the SiO<sub>2</sub>, leaving behind a thin gap between two Si layers spaced apart by nanometer-scale Si posts. Demonstration of this final step by successfully undercutting the a-Si upper layer due to the hydrophobic nature of silicon and the slow etch rate of buffered oxide etch in the small gap has proved to be problematic. Arriving at a feasible solution to this conundrum is the current objective of this project in order to begin investigating the thermal conductivity properties of the structure." @default.
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- W2078972003 date "2007-02-08" @default.
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- W2078972003 title "Nanogap experiments for laser cooling: a progress report" @default.
- W2078972003 doi "https://doi.org/10.1117/12.708585" @default.
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