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• W2078994988 abstract "In this paper lumped approach to establish a package model for multi-cell GaN devices is presented. EM simulated s-parameters are matched to that measured on open and short structures. Initial lumped equivalent R-L-C elements are obtained by studying scaling behavior on standard elements. The model is integrated with GaN unit cell model to construct a package device. The model behavior is validated at 0.9, 2.1 and 3.5GHz for output power levels exceeding 100Watts for 1 to 10 cells at 48Volts." @default.
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• W2078994988 date "2012-06-01" @default.
• W2078994988 modified "2023-09-27" @default.
• W2078994988 title "Broadband lumped package modeling for scaling multi-cell GaN HEMT power devices" @default.
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• W2078994988 doi "https://doi.org/10.1109/arftg79.2012.6291193" @default.
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