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- W2079027477 abstract "Due to rapid and continual changes in the components and designs of portable electronic devices, it is essential to have the ability to perform quick, cost-effective and accurate assessments of the drop impact performance of component interconnections for portable applications. In order to understand the phenomena of solder joint fatigue under impact-induced PCB bending, a tester was developed specifically for applying high bending strains at high strain rates to a PCB assembly. Fatigue characteristics of solder joints were determined for various PCB strains, allowing the construction of fatigue E-N (strain vs. cycles-to-failure) curves. Fatigue data was also generated for several bending frequencies in a study of the effect of strain rate on drop impact performance. Higher bending frequencies were found to reduce fatigue life. A comprehensive test method would also have to be capable of applying variable loading levels in order to replicate the complex loading spectrums seen in actual product drops. A variable amplitude study is presented, where crack propagation tracking shows the effect of changes in load levels on the crack growth rate. Finally, a study on the effect of low temperatures on drop impact reliability is presented, where fatigue characteristics were obtained using the bend tester fitted with a cold temperature chamber." @default.
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- W2079027477 date "2008-12-01" @default.
- W2079027477 modified "2023-09-23" @default.
- W2079027477 title "A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests" @default.
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- W2079027477 doi "https://doi.org/10.1109/eptc.2008.4763576" @default.
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