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- W2079100438 abstract "This paper presents a number of numerical process models of the infra-red reflow soldering process, the major joining process for surface mount assemblies. The aim of this work is to investigate the key process and design variables and their effect on joint quality in the final assembly. The paper includes models of a bare printed circuit board and “J” and “Gull-Wing” leaded components on a printed circuit board all passing through an infra-red oven. The process models are based and I-DEAS modeling suite and TMG thermal solver and are likely to find application in process design." @default.
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- W2079100438 date "1991-01-01" @default.
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- W2079100438 title "SMD Reflow Soldering: A Thermal Process Model" @default.
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- W2079100438 doi "https://doi.org/10.1016/s0007-8506(07)61925-8" @default.
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