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- W2079340511 abstract "Electromigration reliability of solder interconnects is dominated by current density and temperature inside the interconnects. For flip-chip packages, current densities around the regions where the traces connect a solder bump increase significantly due to the differences in feature sizes and electric resistivities between the solder bump and its adjacent traces. This current-crowding effect along with induced Joule heating accelerates electromigration failures. In this paper, the effects of current crowding and Joule heating in a flip-chip package are examined and quantified by three-dimensional electrothermal coupling analysis. We apply a volumetric averaging technique to cope with the current-crowding singularity. The volumetrically averaged current density and the maximum temperature in a solder bump are integrated into Black’s equation to calibrate the experimental electromigration fatigue lives." @default.
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- W2079340511 date "2008-02-26" @default.
- W2079340511 modified "2023-09-27" @default.
- W2079340511 title "Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis" @default.
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- W2079340511 doi "https://doi.org/10.1007/s11664-007-0374-3" @default.
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