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- W2079353656 abstract "In this article, an experimental device used for thermal contact conductance tests under low temperature and vacuum was demonstrated in detail, which may be used to simulate the real environment of some solid materials, such as stainless steel, or aluminum in a space satellite. Thermal contact conductance experiments of stainless steel, of aluminum, and between stainless steel and aluminum were made for 0.02 Pa and 100–330 K. The relationships of thermal contact conductance to the contact loading pressure and to the temperature were measured. It is demonstrated that the thermal contact conductance between stainless steel, aluminum, between stainless steel, and aluminum contacts rises with the temperature increase of the contact interface, as well as the loading pressure increase of the contact interface. The thermal contact conductance of aluminum is larger than that of stainless steel for the same temperature and same loading pressure of the contact interface. The thermal contact conductance between stainless steel and aluminum is close to that between aluminum contacts at the same temperature and same loading pressure of the contact interface." @default.
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- W2079353656 date "2004-09-01" @default.
- W2079353656 modified "2023-10-07" @default.
- W2079353656 title "Thermal contact conductance between solid interfaces under low temperature and vacuum" @default.
- W2079353656 cites W2055844350 @default.
- W2079353656 doi "https://doi.org/10.1063/1.1786356" @default.
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