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- W2079361854 abstract "We investigate an all dry etching process of the development-free vapor photolithography (DFVP) with 315 XeF excimer laser. After masked exposure, SiO<SUB>2</SUB> on a silicon wafer and beneath a photoaccelerator polymer layer can be directly etched by etching vapor which is a mixture of HF, water and N<SUB>2</SUB>. Ultimately, patterns with 0.4 micron resolution were obtained. We have investigated the effect of the etching temperature and time, exposure energy and 5-ni-troacenaphthene concentration on the resolution and discussed the mechanism of DFVP." @default.
- W2079361854 created "2016-06-24" @default.
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- W2079361854 date "1995-06-09" @default.
- W2079361854 modified "2023-10-06" @default.
- W2079361854 title "<title>Development-free vapor laser photolithography with 0.4-um resolution</title>" @default.
- W2079361854 doi "https://doi.org/10.1117/12.210405" @default.
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