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- W2079368499 abstract "Abstract Experimental results on internal stress, Young's modulus and adhesion of metal and compound films are presented and the correlation between these quantities is discussed. Internal stress and Young's modulus were determined by simultaneous in situ measurements during film deposition. In addition to the internal stress values of metal films, which have been given by many workers, we include results on compound films, some of which showed compressive stresses. The Young's moduli of films of such compounds as MgF2 and TiC and of carbon, which have not previously been established, were determined. The strain energy density accumulated in a film during deposition was evaluated from the measured values of Young's modulus and internal stress. In some films, cracks or wrinkles were generated by strain energy, leading to the spontaneous peeling of the films from the substrates. The adhesion experiments were performed using the topple and pull test. The adhesive forces were directly measured and the adhesion energies were estimated. The effect of the substrate temperature and ion bombardment on the adhesion were investigated. The values of adhesion energies were compared with strain energies and the meaning of the adhesion test was considered." @default.
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- W2079368499 date "1986-08-01" @default.
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- W2079368499 title "Mechanical properties of metal and compound films" @default.
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- W2079368499 doi "https://doi.org/10.1016/0040-6090(86)90351-2" @default.
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