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- W2079455324 abstract "The requirements of the 0.18 micrometers and 0.25 micrometers technologies lead to advanced specifications for the mask making technology in terms of pattern placement metrology, tighter than 52nm for the 0.25 micrometers generation and around 35nm for the next 0.18 micrometers generation. In addition, the tremendous demand regarding cycle time reduction, performance to delivery schedule, and technical complexity on products impose to the mask manufacturer like Dupont Photomasks Inc. (DPI) the necessity to mix and match products between all the DPI sites. From this perspective, the matching of all the pattern placement metrology tools of all DPI production sites is mandatory. In order to control the tight specifications, the strategy for metrology is to implement a unique grid for registration on a world wide base at DPI and to calibrate all metrology tools and all writing tools to this standard grid. All investigations were performed on the LEICA LMS IPRO tools using the new correction software form Leica Microsystems." @default.
- W2079455324 created "2016-06-24" @default.
- W2079455324 creator A5077806442 @default.
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- W2079455324 date "1999-04-23" @default.
- W2079455324 modified "2023-09-23" @default.
- W2079455324 title "Pattern placement metrology tool matching within DPI's sites" @default.
- W2079455324 doi "https://doi.org/10.1117/12.346209" @default.
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