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- W2079475061 abstract "The mixing of 10:1 direct step on wafer aligner to a 1:1 full mask projection aligner has often been proposed.1 This hybrid alignment scheme offers the advantages of excellent registration and high resolution found in the current steppers in combination with the established throughput and lower cost of the 1:1 projection aligners. This paper reports on fabrication of HMOS circuits using the hybrid technique at one critical layer. Full integration of the automatic global alignment features, field-by-field alignment, process control drop-ins and automatic framing has been accomplished. A technique for comparison of the registration between the conventional and hybrid process will be presented. Considerations of mask and reticle layout will be discussed. The influence of the additional time required for field-by-field alignment in a theoretical model will be presented.© (1982) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only." @default.
- W2079475061 created "2016-06-24" @default.
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- W2079475061 date "1982-09-13" @default.
- W2079475061 modified "2023-09-26" @default.
- W2079475061 title "<title>Hybrid Lithography: Mixing Of 10:1 And 1:1 Projection Aligners</title>" @default.
- W2079475061 doi "https://doi.org/10.1117/12.933571" @default.
- W2079475061 hasPublicationYear "1982" @default.
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