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- W2079708202 abstract "Abstract This paper reports our investigation on the evolution of microstructure, hardness, and electrical conductivity of in situ Cu–16.5 vol.%Nb microcomposites as a function of drawing strain. Both interface area density and lattice distortion were taken into account for analyzing the hardness and resistivity at different levels of plastic strain. A model was developed for describing microstructure dimensions including both spacing and curl of Nb ribbons. Based on this model, a modified Hall–Petch formula was derived. Our results suggest that interface area density and lattice distortion have significant impacts on both hardness and electrical resistivity." @default.
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- W2079708202 date "2014-07-01" @default.
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- W2079708202 title "Hardness, electrical resistivity, and modeling of in situ Cu–Nb microcomposites" @default.
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- W2079708202 doi "https://doi.org/10.1016/j.jallcom.2014.03.021" @default.
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