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- W2079791390 abstract "Abstract A theory is derived which relates the device characteristics, in particular the ultra-high frequency performance of field-effect transistors (FETs) to thermal properties. The method of successive approximation is used to simultaneously calculate device temperature and power developed in the channel. FET's are thermally stable only when the device temperature under operating conditions does not contribute significantly to the carrier concentration which is difficult to achieve in modern devices where either high mobility materials and/or small channel lengths are used. The influence of semiconductor-, insulator-, and substrate-material, geometry and thermal properties upon thermal stability and ultra-high frequency performance are discussed. The theory is applied to InAs on glass-, Silicon on Sapphire-, and GaAs on Sapphire-FET's and the high frequency performance of these devices under thermal constraints is determined." @default.
- W2079791390 created "2016-06-24" @default.
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- W2079791390 date "1969-09-01" @default.
- W2079791390 modified "2023-10-01" @default.
- W2079791390 title "Effect of thermal instability on ultra-high frequency performance of insulated-gate field-effect transistors" @default.
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- W2079791390 doi "https://doi.org/10.1016/0038-1101(69)90067-7" @default.
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