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• W2079891352 endingPage "012024" @default.
• W2079891352 startingPage "012024" @default.
• W2079891352 abstract "We describe properties of MIM capacitor structures with the RuO2 bottom electrode, TiO2 dielectric film and various top electrodes. The TiO2 films were grown by atomic layer deposition (ALD) at temperature 425 °C on metal organic chemical vapour deposited (MOCVD) RuO2 bottom electrodes grown at 300 °C. Due to local epitaxial growth on the RuO2 rutile structure, TiO2 films with the permittivity 135 and equivalent oxide thickness 0.58 nm were obtained. Capacitance density as high as 60 fF/μm2 was achieved. Au and Ni films for top electrodes were prepared by evaporation at room temperature. RuO2 films for top electrodes were grown by MOCVD. Strong effect of top electrode material on capacitance and leakage currents was observed. In addition, the stacks with TiO2 dielectric were found to be very sensitive to oxygen post-deposition treatment." @default.
• W2079891352 created "2016-06-24" @default.
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• W2079891352 date "2010-02-01" @default.
• W2079891352 modified "2023-10-14" @default.
• W2079891352 title "High-permittivity metal-insulator-metal capacitors with TiO₂rutile dielectric and RuO₂bottom electrode" @default.
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• W2079891352 doi "https://doi.org/10.1088/1757-899x/8/1/012024" @default.
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