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- W2080447356 abstract "In this study, a 3x-nm after development inspection (ADI) wafer with focus exposure matrix (FEM) was inspected with both an advanced optical system and an advanced electron beam inspection (EBI) system, and the inspection results were carefully examined. We found that EBI can capture much more defects than optical system and it also can provide more information about within reticle shot defect distribution. It has high capture rate of certain critical defects that are insensitive to optical system, such as nano-bridges. We also studied the critical dimension (CD) variations caused by the optical inspection and EBI." @default.
- W2080447356 created "2016-06-24" @default.
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- W2080447356 date "2010-03-11" @default.
- W2080447356 modified "2023-10-17" @default.
- W2080447356 title "After development inspection defectivity studies of an advanced memory device" @default.
- W2080447356 doi "https://doi.org/10.1117/12.848066" @default.
- W2080447356 hasPublicationYear "2010" @default.
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