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• W2080513077 abstract "The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires improvements in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and are now being implemented side-by-side with more standard technology typically used in flight hardware." @default.
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• W2080513077 date "2012-03-01" @default.
• W2080513077 modified "2023-10-01" @default.
• W2080513077 title "Robust, rework-able thermal electronic packaging: Applications in high power TR modules for space" @default.
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• W2080513077 doi "https://doi.org/10.1109/aero.2012.6187085" @default.
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