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• W2080521670 abstract "Understanding the ageing of materials for electronic application is a complex challenge, in particular for composite material as electrically conductive adhesive consisting of a nonconductive polymer binder and conductive filler particles. This research involves a large amount of parameters related to both operating conditions and material structure, which act together. Accelerated testing, with the aim to consume rapidly lifetime without inducing incorrect failure mechanisms, is difficult to optimize and its modelling to describe the ageing process is a challenge. To reach this aim could be interesting for the characterization of the material but above all for the general validity of the proposed methodology." @default.
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• W2080521670 date "2013-01-01" @default.
• W2080521670 modified "2023-09-25" @default.
• W2080521670 title "Optimization of accelerated testing through design of experiment for ageing of lead-free electronic interconnection material" @default.
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• W2080521670 doi "https://doi.org/10.1051/ijmqe/2012037" @default.
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