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• W2080705251 abstract "In this study, a large number of creep tests were carried out using miniature specimens in order to investigate the creep behavior of 63Sn/37Pb eutectic solder alloy over a wide temperature range from −40 to 150°C and stress range from 0.75 to 70 MPa. Based on dislocation and diffusion theories, two unified constitutive models were developed to describe the dislocation-controlled and diffusion-controlled creep behaviors observed. It was found that the two models accurately predict the experimental data. A deformation mechanism map was established for this eutectic solder alloy in order to interpret the creep mechanism under different temperature and loading conditions." @default.
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• W2080705251 date "2002-12-31" @default.
• W2080705251 modified "2023-09-26" @default.
• W2080705251 title "Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy" @default.
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• W2080705251 doi "https://doi.org/10.1115/1.1525254" @default.
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