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• W2080861127 endingPage "984" @default.
• W2080861127 startingPage "979" @default.
• W2080861127 abstract "In this research, thousands of 20-μm pitch microbumps with a diameter of 10 μm and a structure of a pure Sn cap on a Cu pillar were electroplated on 8-inch wafers, and those wafers were then respectively singularized as a top chip and bottom Si interposer for stacking. Two methods, namely conventional reflow and solid-liquid interdiffusion (SLID) bonding, were adopted to interconnect the microbumps. In the former case, the as-plated Sn caps were fluxed, and the chip was then placed on the Si interposer. Afterward, the Sn caps on the chip and on the Si interposer were melted and interconnected at a peak temperature of 250 <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>°</sup> C. The flux residues were cleaned after reflow, and the microgap between the chip and the Si interposer was fully sealed by a capillary underfill. In the SLID bonding process, the oxides on the as-plated Sn caps were removed by a plasma etcher first, and then the chip was placed on the interposer with a bonder as well, subsequently, the Sn caps were heated to 260°C to react with the Cu pillar to form Cu <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</sub> Sn <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</sub> . In the final step, the intermetallic microjoints were protected by the same capillary underfill. After assembly, the Joint Electron Devices Engineering Council preconditioning test was used to screen the test vehicles for reliability assessment, and then a temperature cycling test was performed to predict the lifespan of the microjoints. The test results showed that the microjoints formed by SLID bonding provided a superior reliability performance to those assembled by reflow. The fracture of the microjoints was caused by the volume contraction induced by the growth of Cu <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</sub> Sn <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</sub> , but the failure mechanisms of those two microjoints were quite different." @default.
• W2080861127 created "2016-06-24" @default.
• W2080861127 creator A5024212834 @default.
• W2080861127 creator A5029189256 @default.
• W2080861127 creator A5032101985 @default.
• W2080861127 creator A5045848946 @default.
• W2080861127 creator A5050009510 @default.
• W2080861127 date "2012-06-01" @default.
• W2080861127 modified "2023-09-23" @default.
• W2080861127 title "Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture" @default.
• W2080861127 cites W1978027747 @default.
• W2080861127 cites W2007304334 @default.
• W2080861127 cites W2027757536 @default.
• W2080861127 cites W2031579205 @default.
• W2080861127 cites W2036137359 @default.
• W2080861127 cites W2077640272 @default.
• W2080861127 cites W2093296199 @default.
• W2080861127 cites W2103747527 @default.
• W2080861127 cites W2109500250 @default.
• W2080861127 cites W2110641793 @default.
• W2080861127 cites W2123529675 @default.
• W2080861127 cites W2124553723 @default.
• W2080861127 cites W2124797477 @default.
• W2080861127 cites W2125128523 @default.
• W2080861127 cites W4234859442 @default.
• W2080861127 cites W2113421173 @default.
• W2080861127 cites W2129867995 @default.
• W2080861127 doi "https://doi.org/10.1109/tcpmt.2012.2190290" @default.
• W2080861127 hasPublicationYear "2012" @default.
• W2080861127 type Work @default.
• W2080861127 sameAs 2080861127 @default.
• W2080861127 citedByCount "25" @default.
• W2080861127 countsByYear W20808611272012 @default.
• W2080861127 countsByYear W20808611272013 @default.
• W2080861127 countsByYear W20808611272014 @default.
• W2080861127 countsByYear W20808611272015 @default.
• W2080861127 countsByYear W20808611272016 @default.
• W2080861127 countsByYear W20808611272017 @default.
• W2080861127 countsByYear W20808611272018 @default.
• W2080861127 countsByYear W20808611272019 @default.
• W2080861127 countsByYear W20808611272020 @default.
• W2080861127 countsByYear W20808611272021 @default.
• W2080861127 countsByYear W20808611272022 @default.
• W2080861127 countsByYear W20808611272023 @default.
• W2080861127 crossrefType "journal-article" @default.
• W2080861127 hasAuthorship W2080861127A5024212834 @default.
• W2080861127 hasAuthorship W2080861127A5029189256 @default.
• W2080861127 hasAuthorship W2080861127A5032101985 @default.
• W2080861127 hasAuthorship W2080861127A5045848946 @default.
• W2080861127 hasAuthorship W2080861127A5050009510 @default.
• W2080861127 hasBestOaLocation W20808611272 @default.
• W2080861127 hasConcept C100460472 @default.
• W2080861127 hasConcept C119599485 @default.
• W2080861127 hasConcept C123745756 @default.
• W2080861127 hasConcept C127413603 @default.
• W2080861127 hasConcept C158802814 @default.
• W2080861127 hasConcept C159985019 @default.
• W2080861127 hasConcept C160671074 @default.
• W2080861127 hasConcept C165005293 @default.
• W2080861127 hasConcept C178790620 @default.
• W2080861127 hasConcept C185592680 @default.
• W2080861127 hasConcept C192562407 @default.
• W2080861127 hasConcept C27501479 @default.
• W2080861127 hasConcept C2779227376 @default.
• W2080861127 hasConcept C2780026712 @default.
• W2080861127 hasConcept C31258907 @default.
• W2080861127 hasConcept C33347731 @default.
• W2080861127 hasConcept C41008148 @default.
• W2080861127 hasConcept C49040817 @default.
• W2080861127 hasConcept C530198007 @default.
• W2080861127 hasConcept C59088047 @default.
• W2080861127 hasConcept C68928338 @default.
• W2080861127 hasConcept C79072407 @default.
• W2080861127 hasConceptScore W2080861127C100460472 @default.
• W2080861127 hasConceptScore W2080861127C119599485 @default.
• W2080861127 hasConceptScore W2080861127C123745756 @default.
• W2080861127 hasConceptScore W2080861127C127413603 @default.
• W2080861127 hasConceptScore W2080861127C158802814 @default.
• W2080861127 hasConceptScore W2080861127C159985019 @default.
• W2080861127 hasConceptScore W2080861127C160671074 @default.
• W2080861127 hasConceptScore W2080861127C165005293 @default.
• W2080861127 hasConceptScore W2080861127C178790620 @default.
• W2080861127 hasConceptScore W2080861127C185592680 @default.
• W2080861127 hasConceptScore W2080861127C192562407 @default.
• W2080861127 hasConceptScore W2080861127C27501479 @default.
• W2080861127 hasConceptScore W2080861127C2779227376 @default.
• W2080861127 hasConceptScore W2080861127C2780026712 @default.
• W2080861127 hasConceptScore W2080861127C31258907 @default.
• W2080861127 hasConceptScore W2080861127C33347731 @default.
• W2080861127 hasConceptScore W2080861127C41008148 @default.
• W2080861127 hasConceptScore W2080861127C49040817 @default.
• W2080861127 hasConceptScore W2080861127C530198007 @default.
• W2080861127 hasConceptScore W2080861127C59088047 @default.
• W2080861127 hasConceptScore W2080861127C68928338 @default.
• W2080861127 hasConceptScore W2080861127C79072407 @default.
• W2080861127 hasIssue "6" @default.
• W2080861127 hasLocation W20808611271 @default.
• W2080861127 hasLocation W20808611272 @default.

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