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• W2081399724 abstract "High through put thermal compression NCF bonding was studied and the new process consisting of dividing pre and main bonding, and the multi die gang main bonding has been developed. The dividing could change the process from serial to parallel and enabled to use the constant heated bonder head, which eliminated the time consuming head cooling process of the conventional serial thermal compression bonding. The die of 7.3 × 7.3 × 0.1 mm size with bumps of 38 × 38 μm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> square Cu pillar covered by Sn-Ag cap, which had the pitches of 80 μm at peripheral and 300 μm at corer area, and the organic laminated substrate with Cu/OSP trace were used as the test vehicle in this study. Firstly, the dividing of pre and main bo ndi ng process in the case of si ngle die was investigated. The prebonding was the die placement to the NCF on the substrate, which was carried out at 150°C for 0.5 second. The substrate was kept at 80°C during the process. After the pre bonding the test vehicle was removed out from the equipment and cooled down to room temperature. And then it was mounted back to the equipment again and main bonding was carried out at 240°C for 20 seconds. The same substrate temperature as the pre bonding process was kept. Solder joint formation and NCF curing was made at the process. The assembled test vehicle was evaluated. The cross sectional observation results showed that the bump solder wetted the Cu trace on the substrate and no void was detected in the NCF by C-SAM observation. Secondly, the multi die main gang bonding was studied. The equipment was newly designed and built. 15 dies were pre bonded on the substrate with the same condition as that of the single die experiment. After the pre bonding was finished, the substrate was moved to the main gang bonder. During the transportation the substrate was cooled down to room temperature. The 15 dies were bonded at one time at 240°C for 10 seconds. The substrate was heated at 240°C during the process. The evaluation of the assembled dies revealed that the solder wettability of the joints and void detection in the NCF was almost the same as those of the single die pre and main divided bonding. This main bonding process time corresponded to 2700 UPH." @default.
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• W2081399724 date "2014-05-01" @default.
• W2081399724 modified "2023-10-16" @default.
• W2081399724 title "High throughput thermal compression NCF bonding" @default.
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• W2081399724 doi "https://doi.org/10.1109/ectc.2014.6897396" @default.
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