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- W2081750304 abstract "Convergent beam electron diffraction (CBED) on cross-sectional transmission electron microscopy (TEM) specimens can map stress in the Si substrate of microelectronics devices with high spatial resolution. However, at shallow depths below the interface the diffraction lines within a CBED pattern are split, rendering pattern interpretation impossible in the classical way. This effect is believed to derive from a bending of the diffracting planes through the sample thickness. In this work, a variety of specimens, ranging from polycrystalline to epitaxial and amorphous materials, have been systematically analyzed. A similar qualitative distribution of the splitting effects is present in each case, but quantitative differences are observed which can be related to the stress induced by the different materials. Capping layers can partially avoid the splitting but seem to modify the strain distribution. The surface relaxation in the thin TEM specimen foil is modelled by finite elements simulations as well as with an epitaxial-layer model. The results predict well the experimental magnitude of the splitting but fail to simulate the intensity of the secondary lines. Possible explanations for such discrepancies are discussed and critically assessed." @default.
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- W2081750304 date "2007-01-01" @default.
- W2081750304 modified "2023-10-16" @default.
- W2081750304 title "On the Splitting of High Order Laue Zone Lines in CBED Analysis of Stress in Silicon" @default.
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- W2081750304 doi "https://doi.org/10.1149/1.2432060" @default.
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