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• W2082129858 abstract "Hydrogenated amorphous silicon carbide (a-SiC:H) deposited by PECVD is one of the most promising dielectric diffusion barrier available in Cu—Ultra low k interconnections due to its low dielectric constant and good barrier ability. In this work, the mechanical stress evolution with time of a-SiC:H film exposed to room atmosphere is studied and compared with the behavior observed on other PECVD dielectrics (SiN, SiO2, SiCN). For as-deposited a-SiC:H samples, a strong stress evolution with time toward compression is observed and the results are interpreted mainly in terms of surface reactivity and silanol buildup. Infrared spectroscopy analysis allows to confirm that the mechanical stress evolution and the OH content are linked. An oxidation of the hydrogenated amorphous silicon carbide film with time is also observed. Different plasma treatments (He, O2 or H2) are tested on a-SiC:H films to limit the stress drift with time. Each plasma treatments are able to limit the stress evolution of a-SiC:H films but the mechanisms are different in each case: densification of the film with He plasma treatment, formation of a dense oxide at the surface with O2 plasma treatment and passivation of dangling bonds with H2 plasma treatment." @default.
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• W2082129858 date "2004-01-01" @default.
• W2082129858 modified "2023-09-26" @default.
• W2082129858 title "Mechanical stress in PECVD a-SiC:H: aging and plasma treatments effects" @default.
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• W2082129858 doi "https://doi.org/10.1016/j.mssp.2004.09.109" @default.
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