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- W2082921247 abstract "The resultant thermoelectric power factors P of three types of Cu∕Bi∕Cu,Ni∕Bi∕Ni, and Cu∕Bi∕Ni composite materials welded with Bi were measured at 298 K as a function of relative thickness of Bi and compared with P values calculated by treating these devices as an electrical and thermal circuit. It was first demonstrated experimentally that the observed P values of composite devices have a local maximum at an optimum volume fraction (corresponding to the thickness) of Bi, as predicted theoretically. The maximum P values of composite materials were several times higher than those of pure Ni and Bi and were about 100 times larger than that of pure Cu. The dependence of P on the thickness of Bi was found to be explained roughly by introducing the modified thermal conductivity and an enhancement factor in the Seebeck coefficient to our simple model in which a device was treated as an electrical and thermal circuit." @default.
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- W2082921247 date "2005-05-13" @default.
- W2082921247 modified "2023-10-16" @default.
- W2082921247 title "Increase of the thermoelectric power factor in Cu∕Bi∕Cu,Ni∕Bi∕Ni, and Cu∕Bi∕Ni composite materials" @default.
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- W2082921247 doi "https://doi.org/10.1063/1.1895468" @default.
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