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• W2083118555 abstract "As high-speed, high-density, and high-performance are the primary IC development targets, packaging technologies play a key role to bring out the best performance of those ICs. In this paper, an active component formed by an active chip embedded technology is developed for the package of a high speed DDR2 memory device. Embedding of semiconductor chips into an organic substrate provide a solution to miniaturize the size of the package. Moreover, stacking multiple layers of embedded components can allow an even higher capacity of devices and packaging density. In addition to wire bonding or w-BGA technologies, embedded package structure provides an alternative means to form redistribution circuits and electrical bonding pads. Meanwhile the electrical performance can be enhanced due to the wafer level package-like structure. Superior electrical performance is provided by forming shorter electrical path from chip pad to outer. In this study, a chip-in-substrate package (CiSP) with a real 50 um thick DDR2 memory IC is achieved using built-up technologies such as dielectric layer lamination, micro via drilling, and redistribution layer forming to implement the JEDEC-compliant DDR2 component. The PCB compatible process is a low-cost, high-yield, and versatile technology. Electrical performance similar to wafer level package and even better than wire bonding or w-BGA package can be achieved by adopting this proposed solution. The DDR2 component is assembled on a dual in-line memory module (DIMM) to study the feasibility and electrical performance of this developed package. Subsequent reliability test such as thermal cycle test (TCT) and thermal humidity storage test (THST) are examined. And electromigration (EM) of this test vehicle under high current density is simulated and tested." @default.
• W2083118555 created "2016-06-24" @default.
• W2083118555 creator A5012284337 @default.
• W2083118555 creator A5024212834 @default.
• W2083118555 creator A5026416342 @default.
• W2083118555 creator A5031122057 @default.
• W2083118555 creator A5032101985 @default.
• W2083118555 creator A5038760315 @default.
• W2083118555 creator A5039560569 @default.
• W2083118555 creator A5041463855 @default.
• W2083118555 creator A5045848946 @default.
• W2083118555 creator A5049555850 @default.
• W2083118555 creator A5079257823 @default.
• W2083118555 creator A5088109393 @default.
• W2083118555 creator A5088946293 @default.
• W2083118555 date "2010-10-01" @default.
• W2083118555 modified "2023-09-23" @default.
• W2083118555 title "Processing characteristics and reliability of embedded DDR2 memory chips" @default.
• W2083118555 cites W2090355199 @default.
• W2083118555 cites W2096489898 @default.
• W2083118555 cites W2131111509 @default.
• W2083118555 cites W2157075294 @default.
• W2083118555 doi "https://doi.org/10.1109/impact.2010.5699572" @default.
• W2083118555 hasPublicationYear "2010" @default.
• W2083118555 type Work @default.
• W2083118555 sameAs 2083118555 @default.
• W2083118555 citedByCount "2" @default.
• W2083118555 countsByYear W20831185552013 @default.
• W2083118555 countsByYear W20831185552014 @default.
• W2083118555 crossrefType "proceedings-article" @default.
• W2083118555 hasAuthorship W2083118555A5012284337 @default.
• W2083118555 hasAuthorship W2083118555A5024212834 @default.
• W2083118555 hasAuthorship W2083118555A5026416342 @default.
• W2083118555 hasAuthorship W2083118555A5031122057 @default.
• W2083118555 hasAuthorship W2083118555A5032101985 @default.
• W2083118555 hasAuthorship W2083118555A5038760315 @default.
• W2083118555 hasAuthorship W2083118555A5039560569 @default.
• W2083118555 hasAuthorship W2083118555A5041463855 @default.
• W2083118555 hasAuthorship W2083118555A5045848946 @default.
• W2083118555 hasAuthorship W2083118555A5049555850 @default.
• W2083118555 hasAuthorship W2083118555A5079257823 @default.
• W2083118555 hasAuthorship W2083118555A5088109393 @default.
• W2083118555 hasAuthorship W2083118555A5088946293 @default.
• W2083118555 hasConcept C119599485 @default.
• W2083118555 hasConcept C126233035 @default.
• W2083118555 hasConcept C127413603 @default.
• W2083118555 hasConcept C140269135 @default.
• W2083118555 hasConcept C146667757 @default.
• W2083118555 hasConcept C159985019 @default.
• W2083118555 hasConcept C160671074 @default.
• W2083118555 hasConcept C162877825 @default.
• W2083118555 hasConcept C165005293 @default.
• W2083118555 hasConcept C171250308 @default.
• W2083118555 hasConcept C192562407 @default.
• W2083118555 hasConcept C193149544 @default.
• W2083118555 hasConcept C24326235 @default.
• W2083118555 hasConcept C2779227376 @default.
• W2083118555 hasConcept C49040817 @default.
• W2083118555 hasConcept C50296614 @default.
• W2083118555 hasConcept C530198007 @default.
• W2083118555 hasConcept C59088047 @default.
• W2083118555 hasConcept C68928338 @default.
• W2083118555 hasConcept C7366592 @default.
• W2083118555 hasConcept C78519656 @default.
• W2083118555 hasConcept C94709252 @default.
• W2083118555 hasConceptScore W2083118555C119599485 @default.
• W2083118555 hasConceptScore W2083118555C126233035 @default.
• W2083118555 hasConceptScore W2083118555C127413603 @default.
• W2083118555 hasConceptScore W2083118555C140269135 @default.
• W2083118555 hasConceptScore W2083118555C146667757 @default.
• W2083118555 hasConceptScore W2083118555C159985019 @default.
• W2083118555 hasConceptScore W2083118555C160671074 @default.
• W2083118555 hasConceptScore W2083118555C162877825 @default.
• W2083118555 hasConceptScore W2083118555C165005293 @default.
• W2083118555 hasConceptScore W2083118555C171250308 @default.
• W2083118555 hasConceptScore W2083118555C192562407 @default.
• W2083118555 hasConceptScore W2083118555C193149544 @default.
• W2083118555 hasConceptScore W2083118555C24326235 @default.
• W2083118555 hasConceptScore W2083118555C2779227376 @default.
• W2083118555 hasConceptScore W2083118555C49040817 @default.
• W2083118555 hasConceptScore W2083118555C50296614 @default.
• W2083118555 hasConceptScore W2083118555C530198007 @default.
• W2083118555 hasConceptScore W2083118555C59088047 @default.
• W2083118555 hasConceptScore W2083118555C68928338 @default.
• W2083118555 hasConceptScore W2083118555C7366592 @default.
• W2083118555 hasConceptScore W2083118555C78519656 @default.
• W2083118555 hasConceptScore W2083118555C94709252 @default.
• W2083118555 hasLocation W20831185551 @default.
• W2083118555 hasOpenAccess W2083118555 @default.
• W2083118555 hasPrimaryLocation W20831185551 @default.
• W2083118555 hasRelatedWork W2035296778 @default.
• W2083118555 hasRelatedWork W2059614242 @default.
• W2083118555 hasRelatedWork W2063549554 @default.
• W2083118555 hasRelatedWork W2095617509 @default.
• W2083118555 hasRelatedWork W2102309245 @default.
• W2083118555 hasRelatedWork W2113532997 @default.
• W2083118555 hasRelatedWork W2117186315 @default.
• W2083118555 hasRelatedWork W2125368863 @default.
• W2083118555 hasRelatedWork W2128848316 @default.
• W2083118555 hasRelatedWork W2131269311 @default.

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