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• W2083158471 abstract "Electrical characteristics of 25 nm Al-doped TiO2 (ATO) dielectric films are investigated in an effort to access the benefits of TiO2’s high dielectric constant (κ) while minimizing leakage current as needed for nanocapacitor applications. Al-doped films with 0-3.9 at. % Al were deposited using atomic layer deposition (ALD). As-deposited films of all compositions were amorphous and had poor electrical performance. Annealing at 600 °C was implemented to modify the film structure and to increase electrical performance. Raman spectroscopy monitored phase changes as a result of annealing. The Raman-measured Eg mode provides a clear signature of the anatase crystallization structure and showed the rapid formation of crystalline anatase in all films. The electrical performance of annealed films was significantly improved for films containing Al. Incorporation of few percent Al and annealing created a dramatic drop in leakage current from 10−3–10−4 to 10−7 A/cm2, nearly that of pure Al2O3. Comparing features of the Raman Eg mode with Al-doping displays a strong correlation to leakage currents. Trends observed in the Raman lineshape which relate to microstructural variances are discussed. Raman spectroscopy thus provides a measure of structural changes in ATO films which correlate strongly with its electrical characteristics as doping and annealing are employed to optimize the properties of the high-κ films." @default.
• W2083158471 created "2016-06-24" @default.
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• W2083158471 date "2011-07-01" @default.
• W2083158471 modified "2023-10-16" @default.
• W2083158471 title "Correlation of Raman, electrical, and optical properties of high-κ, atomic layer deposited Al-doped TiO2" @default.
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• W2083158471 doi "https://doi.org/10.1116/1.3610970" @default.
• W2083158471 hasPublicationYear "2011" @default.
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