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- W2083841008 abstract "Purpose – The purpose of this paper is to investigate a Pb‐free solder alternative, specifically the effect of Bi on the microstructure and tensile strength of Sn‐3.7Ag solders casted under different cooling rates." @default.
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- W2083841008 date "2010-06-29" @default.
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- W2083841008 title "Effect of Bi on the microstructure and tensile behavior of Sn‐3.7Ag solders" @default.
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- W2083841008 doi "https://doi.org/10.1108/09540911011054136" @default.
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