FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2085087240> ?p ?o ?g. }

• W2085087240 abstract "In this paper we demonstrate functional 3D circuits obtained by a 3D Stacked IC approach using Die-to-Wafer Hybrid Collective bonding with Cu Through Silicon Vias (TSV). The Cu TSV process is inserted between contact and M1 of our reference 130 nm CMOS process on 200 mm wafers. The top die is thinned down to 25 mum and bonded to the landing wafer by a combination of polymer bonding and copper to copper thermocompression bonding. Top and landing wafers contain CMOS finished with 2 levels of metal in Copper/Oxide. Ring oscillators consisting of inverters distributed over both top and bottom dies interconnected through up to 40 TSVs are used to demonstrate the process. This paper focuses on integration issues solved during process development and electrical characterization of the obtained TSVs." @default.
• W2085087240 created "2016-06-24" @default.
• W2085087240 creator A5005108594 @default.
• W2085087240 creator A5014751688 @default.
• W2085087240 creator A5016839480 @default.
• W2085087240 creator A5027473851 @default.
• W2085087240 creator A5029477844 @default.
• W2085087240 creator A5032421605 @default.
• W2085087240 creator A5032424530 @default.
• W2085087240 creator A5044622111 @default.
• W2085087240 creator A5051712390 @default.
• W2085087240 creator A5055308643 @default.
• W2085087240 creator A5061504157 @default.
• W2085087240 creator A5076274517 @default.
• W2085087240 creator A5091626132 @default.
• W2085087240 date "2009-09-01" @default.
• W2085087240 modified "2023-09-30" @default.
• W2085087240 title "3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV)" @default.
• W2085087240 cites W1578839933 @default.
• W2085087240 cites W1971322722 @default.
• W2085087240 cites W2103139664 @default.
• W2085087240 cites W2126157369 @default.
• W2085087240 cites W2136056669 @default.
• W2085087240 cites W2154133941 @default.
• W2085087240 doi "https://doi.org/10.1109/3dic.2009.5306600" @default.
• W2085087240 hasPublicationYear "2009" @default.
• W2085087240 type Work @default.
• W2085087240 sameAs 2085087240 @default.
• W2085087240 citedByCount "35" @default.
• W2085087240 countsByYear W20850872402012 @default.
• W2085087240 countsByYear W20850872402013 @default.
• W2085087240 countsByYear W20850872402014 @default.
• W2085087240 countsByYear W20850872402016 @default.
• W2085087240 countsByYear W20850872402017 @default.
• W2085087240 countsByYear W20850872402020 @default.
• W2085087240 countsByYear W20850872402023 @default.
• W2085087240 crossrefType "proceedings-article" @default.
• W2085087240 hasAuthorship W2085087240A5005108594 @default.
• W2085087240 hasAuthorship W2085087240A5014751688 @default.
• W2085087240 hasAuthorship W2085087240A5016839480 @default.
• W2085087240 hasAuthorship W2085087240A5027473851 @default.
• W2085087240 hasAuthorship W2085087240A5029477844 @default.
• W2085087240 hasAuthorship W2085087240A5032421605 @default.
• W2085087240 hasAuthorship W2085087240A5032424530 @default.
• W2085087240 hasAuthorship W2085087240A5044622111 @default.
• W2085087240 hasAuthorship W2085087240A5051712390 @default.
• W2085087240 hasAuthorship W2085087240A5055308643 @default.
• W2085087240 hasAuthorship W2085087240A5061504157 @default.
• W2085087240 hasAuthorship W2085087240A5076274517 @default.
• W2085087240 hasAuthorship W2085087240A5091626132 @default.
• W2085087240 hasConcept C111106434 @default.
• W2085087240 hasConcept C127413603 @default.
• W2085087240 hasConcept C160671074 @default.
• W2085087240 hasConcept C171250308 @default.
• W2085087240 hasConcept C191897082 @default.
• W2085087240 hasConcept C192562407 @default.
• W2085087240 hasConcept C201845621 @default.
• W2085087240 hasConcept C24326235 @default.
• W2085087240 hasConcept C2779133538 @default.
• W2085087240 hasConcept C2779227376 @default.
• W2085087240 hasConcept C45632049 @default.
• W2085087240 hasConcept C46362747 @default.
• W2085087240 hasConcept C49040817 @default.
• W2085087240 hasConcept C530198007 @default.
• W2085087240 hasConcept C544778455 @default.
• W2085087240 hasConcept C544956773 @default.
• W2085087240 hasConcept C59088047 @default.
• W2085087240 hasConceptScore W2085087240C111106434 @default.
• W2085087240 hasConceptScore W2085087240C127413603 @default.
• W2085087240 hasConceptScore W2085087240C160671074 @default.
• W2085087240 hasConceptScore W2085087240C171250308 @default.
• W2085087240 hasConceptScore W2085087240C191897082 @default.
• W2085087240 hasConceptScore W2085087240C192562407 @default.
• W2085087240 hasConceptScore W2085087240C201845621 @default.
• W2085087240 hasConceptScore W2085087240C24326235 @default.
• W2085087240 hasConceptScore W2085087240C2779133538 @default.
• W2085087240 hasConceptScore W2085087240C2779227376 @default.
• W2085087240 hasConceptScore W2085087240C45632049 @default.
• W2085087240 hasConceptScore W2085087240C46362747 @default.
• W2085087240 hasConceptScore W2085087240C49040817 @default.
• W2085087240 hasConceptScore W2085087240C530198007 @default.
• W2085087240 hasConceptScore W2085087240C544778455 @default.
• W2085087240 hasConceptScore W2085087240C544956773 @default.
• W2085087240 hasConceptScore W2085087240C59088047 @default.
• W2085087240 hasLocation W20850872401 @default.
• W2085087240 hasOpenAccess W2085087240 @default.
• W2085087240 hasPrimaryLocation W20850872401 @default.
• W2085087240 hasRelatedWork W1966026370 @default.
• W2085087240 hasRelatedWork W2015325658 @default.
• W2085087240 hasRelatedWork W2080427081 @default.
• W2085087240 hasRelatedWork W2085087240 @default.
• W2085087240 hasRelatedWork W2096702712 @default.
• W2085087240 hasRelatedWork W2113453347 @default.
• W2085087240 hasRelatedWork W2122421290 @default.
• W2085087240 hasRelatedWork W2136056669 @default.
• W2085087240 hasRelatedWork W2170209006 @default.
• W2085087240 hasRelatedWork W2539825230 @default.
• W2085087240 isParatext "false" @default.
• W2085087240 isRetracted "false" @default.
• W2085087240 magId "2085087240" @default.

• next