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• W2085163722 abstract "This paper presents porous silicon as a tool for the construction of thermal transducers, reviews advantages of this technology and discusses a surface micromachining process, which produces a large gap between membrane and underlying substrate, using porous silicon as a sacrificial layer. The technology itself and the various etching process stoppage techniques are described as well as the difficulties encountered in porous silicon etching underneath sensor membranes and presentation of solution. Finally, design layout rules for thermal sensor applications using porous silicon technology are defined and discussed." @default.
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• W2085163722 date "2000-09-01" @default.
• W2085163722 modified "2023-10-01" @default.
• W2085163722 title "Structuring of membrane sensors using sacrificial porous silicon" @default.
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• W2085163722 doi "https://doi.org/10.1016/s0924-4247(00)00308-3" @default.
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