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• W2085344513 abstract "Reliability issues associated with thermal-humidity and vapor pressure have become increasingly significant for electronic devices. With the more density of electronic packaging and the trend of lead-free material application, materials of electronic packaging will experience more harsh stress and thermal environment. Therefore, it is significant to investigate failure mechanism of materials applied in microelectronic industry. This paper mainly studies the failure of polymers induced by vapor pressure and thermal stress. During the reflow process, the moisture stored in micro-voids will vaporize and become vapor pressure which causes dilation of the voids in polymer materials. Ultimately, with the voids growing to a critical value, popcorn failure will take place. Hence, in this paper, we firstly analysis the deformation of voids which are subjected to internal vapor pressure and thermal stress simultaneously under the assumption of large deformation. And then the finite element method is applied to simulate the growth of voids under the linear elastic and non-linear model via the commercial FEM software, respectively. By comparison, we may conclude that the deformation on large deflection theory is “stiffer” than that predicted by small. Additionally, numerical results under the infinitesimal deformation assumption have a good agreement with the classical solution in linear elastic theory. Further in this paper, the increase of void volume fractions with respect to vapor pressure are obtained under small and large deformation assumption, respectively. According to the results we acquire, it is notable that the growth of void volume fractions is linearly dependent with the increase of vapor pressure under infinitesimal deformation assumption and nonlinearly dependent on the large deformation theory. Besides, the non-linear constitutive model is taken into consideration in our study. Combining the geometrical non-linearity and material non-linearity analysis, the growth of void volume fractions with respect to vapor pressure are obtained, when the hyperelastic constitutive model is incorporated, which is compared with the consequence without consideration of material non-linearity. At last, we simulate the dynamic growth of voids during the reflow process, and we can clearly see the change of voids with respect to time. This paper will present us a profound understanding of growth of micro voids from the perspective of numerical methods." @default.
• W2085344513 created "2016-06-24" @default.
• W2085344513 creator A5047556887 @default.
• W2085344513 creator A5052367029 @default.
• W2085344513 creator A5072211414 @default.
• W2085344513 date "2012-08-01" @default.
• W2085344513 modified "2023-10-16" @default.
• W2085344513 title "A numerical method on thermal and vapor pressure effects on void growth in electronic packaging" @default.
• W2085344513 cites W141735924 @default.
• W2085344513 cites W1973696883 @default.
• W2085344513 cites W2003805631 @default.
• W2085344513 cites W2004454242 @default.
• W2085344513 cites W2031530571 @default.
• W2085344513 cites W2048853822 @default.
• W2085344513 cites W2050683089 @default.
• W2085344513 cites W2053545755 @default.
• W2085344513 cites W2481236115 @default.
• W2085344513 cites W2591181672 @default.
• W2085344513 cites W261107528 @default.
• W2085344513 cites W2748031671 @default.
• W2085344513 doi "https://doi.org/10.1109/icept-hdp.2012.6474817" @default.
• W2085344513 hasPublicationYear "2012" @default.
• W2085344513 type Work @default.
• W2085344513 sameAs 2085344513 @default.
• W2085344513 citedByCount "0" @default.
• W2085344513 crossrefType "proceedings-article" @default.
• W2085344513 hasAuthorship W2085344513A5047556887 @default.
• W2085344513 hasAuthorship W2085344513A5052367029 @default.
• W2085344513 hasAuthorship W2085344513A5072211414 @default.
• W2085344513 hasConcept C121332964 @default.
• W2085344513 hasConcept C127413603 @default.
• W2085344513 hasConcept C135628077 @default.
• W2085344513 hasConcept C159985019 @default.
• W2085344513 hasConcept C171250308 @default.
• W2085344513 hasConcept C187937830 @default.
• W2085344513 hasConcept C19184958 @default.
• W2085344513 hasConcept C192562407 @default.
• W2085344513 hasConcept C204530211 @default.
• W2085344513 hasConcept C2779772531 @default.
• W2085344513 hasConcept C57879066 @default.
• W2085344513 hasConcept C66938386 @default.
• W2085344513 hasConcept C69567186 @default.
• W2085344513 hasConcept C97355855 @default.
• W2085344513 hasConceptScore W2085344513C121332964 @default.
• W2085344513 hasConceptScore W2085344513C127413603 @default.
• W2085344513 hasConceptScore W2085344513C135628077 @default.
• W2085344513 hasConceptScore W2085344513C159985019 @default.
• W2085344513 hasConceptScore W2085344513C171250308 @default.
• W2085344513 hasConceptScore W2085344513C187937830 @default.
• W2085344513 hasConceptScore W2085344513C19184958 @default.
• W2085344513 hasConceptScore W2085344513C192562407 @default.
• W2085344513 hasConceptScore W2085344513C204530211 @default.
• W2085344513 hasConceptScore W2085344513C2779772531 @default.
• W2085344513 hasConceptScore W2085344513C57879066 @default.
• W2085344513 hasConceptScore W2085344513C66938386 @default.
• W2085344513 hasConceptScore W2085344513C69567186 @default.
• W2085344513 hasConceptScore W2085344513C97355855 @default.
• W2085344513 hasLocation W20853445131 @default.
• W2085344513 hasOpenAccess W2085344513 @default.
• W2085344513 hasPrimaryLocation W20853445131 @default.
• W2085344513 hasRelatedWork W1980123330 @default.
• W2085344513 hasRelatedWork W2017407473 @default.
• W2085344513 hasRelatedWork W2062132894 @default.
• W2085344513 hasRelatedWork W2085344513 @default.
• W2085344513 hasRelatedWork W2096308491 @default.
• W2085344513 hasRelatedWork W2116752984 @default.
• W2085344513 hasRelatedWork W2356400405 @default.
• W2085344513 hasRelatedWork W2368692178 @default.
• W2085344513 hasRelatedWork W2866022476 @default.
• W2085344513 hasRelatedWork W1971041844 @default.
• W2085344513 isParatext "false" @default.
• W2085344513 isRetracted "false" @default.
• W2085344513 magId "2085344513" @default.
• W2085344513 workType "article" @default.