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- W2085361310 abstract "Czochralski-silicon wafers having ring-likely distributed stacking faults (ring-SFs) were investigated by means of copper decoration. The size and density of copper precipitates were measured by X-ray transmission topography and preferential etching. In the outer region of the ring-SFs, electrical properties (recombination lifetime of minority carriers, the dielectric breakdown strength) were found to be excellent. On the other hand, in the inner region of the ring-SFs electrical properties were degraded. These phenomena may be explained by the large defects which remain in the center region of the ingot." @default.
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- W2085361310 date "1992-04-01" @default.
- W2085361310 modified "2023-10-03" @default.
- W2085361310 title "Application of Copper-Decoration Method to Characterize As-Grown Czochralski-Silicon" @default.
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- W2085361310 doi "https://doi.org/10.1143/jjap.31.l439" @default.
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