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- W2085482259 abstract "The purpose of this work is to experimentally demonstrate that overlapping grain structures can be generated and stabilized at high temperatures by embedding arrays of grain boundary barriers. In tungsten lamp wire, strings of embedded potassium bubbles stabilize an overlapping grain structure along the wire axis. This markedly increases its resistance to creep and rupture. Stabilized overlapping grain structures can be achieved in sheet components by selectively doping a material using a combination of ion implantation and diffusion bonding. In this method foils of polycrystalline matrix material are doped with an insoluble element (potassium) by the ion implantation technique. This establishes atomically dispersed potassium in the near-surface regions of the foils. The doped foils are diffusion bonded to form a laminate with embedded, discrete layers of dopant. During diffusion bonding, the dopant atoms diffuse, cluster, and form planar arrays of potassium bubbles. After diffusion bonding, the laminate is annealed for recrystallization. The grain boundaries migrate parallel to the bubble arrays, but are pinned in directions perpendicular to them. This establishes a stabilized, brick-like grain structure." @default.
- W2085482259 created "2016-06-24" @default.
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- W2085482259 date "1999-11-01" @default.
- W2085482259 modified "2023-10-14" @default.
- W2085482259 title "Shaping of grain architecture in tungsten using selective doping" @default.
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- W2085482259 doi "https://doi.org/10.1016/s1359-6462(99)00251-1" @default.
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